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Nov 12

New Release of EMsoft Package

EMSoft 3.1 Release

EMsoftlogo

It is our pleasure to announce the release of the EMsoft 3.1 software package for the dynamical simulation of electron back-scattered diffraction patterns (EBSD), electron channeling patterns (ECP), and electron Kossel patterns (EKP), Dictionary Indexing for EBSD and ECP, along with a series of smaller support programs. This release once again focuses on SEM-based diffraction modalities; release 3.2 (late Summer 2017) will add to this a series of electron imaging modalities for SEM and TEM.

This release is described in some detail in the EMsoft.pdf EMsoft Installation Manual. You should start with this manual before doing anything else.

Additional manual documents are available for EMEBSD simulations, Dictionary Indexing, and HDF5 support for those of you who wish to add your own HDF5-bsased code to the package.

If you wish to contribute to the EMSoft package, please contact M. De Graef via email.

Acknowledgments: In addition to our MURI sponsor (AFOSR FA9550-12-1-0458), we would also like to acknowledge significant support from Mike Jackson and colleagues at BlueQuartz Software. The most recent work is carried out with support from a DoD Vannevar Bush Fellowship, ONR # N00014-16-1-2821, as well as the computational facilities of the Materials Characterization Facility (MCF) at CMU under grant # MCF-677785.

EMSoft 3.0 Release

EMsoftlogo

It is our pleasure to announce the release of the EMsoft 3.0 software package for the dynamical simulation of electron back-scattered diffraction patterns (EBSD), electron channeling patterns (ECP), and electron Kossel patterns (EKP), along with a series of smaller support programs. This package is based on the original CTEMsoft 2.0 package (still available via GitHub), but is a significant improvement. This release focuses on SEM-based diffraction modalities; release 3.1 (Summer 2016) will add to this a series of dictionary-based indexing programs as well as electron channeling contrast image (ECCI) simulations for surface penetrating defects; release 3.2 (Winter 2016) will add all of the TEM programs from CTEMsoft 2.0, updated to the new dynamical libraries.

This release is described in some detail in the EMsoft.pdf Installation Manual. You should start with this manual before doing anything else.

The release is available in several different forms:

  • Run-time version: A run-time environment with precompiled binaries and support files is currently available for the following platforms:
  • Source code: The complete source code (open source) for this release can be found on GitHub. Installation and compilation will require the next item.
  • Software Developer Kit: The EMSoft_SDK can be installed after the source code has been pulled from GitHub; detailed instructions are included in the installation document.

If you install the SDK, several libraries and packages will be installed automatically (CMake, json-fortran, clfortran, HDF5, FFTW3), as described in the EMsoft.pdf manual. Note that you will need a recent version of the gfortran compiler (at least 4.9; the package will not compile with version 4.8; 5.3 is recommended). You must also have OpenCL installed on your machine (on Mac OS X, this requires installation of XCode). The SDK has build scripts for Mac OS X and Linux (tested on CentOS 7).

If you wish to contribute to the EMSoft package, please contact M. De Graef via email.

Acknowledgments: In addition to our MURI sponsor (AFOSR FA9550-12-1-0458), we would also like to acknowledge significant support from Mike Jackson and colleagues at BlueQuartz Software.